基本信息:
- 专利标题： SYSTEM AND METHOD FOR FORMING MULTI-COMPONENT DIELECTRIC FILMS
- 专利标题（中）：系统和方法的形成介电薄膜多组分
- 申请号：EP04750402.2 申请日：2004-04-21
- 公开(公告)号：EP1616042A2 公开(公告)日：2006-01-18
- 发明人： SENZAKI, Yoshihide , PARK, Seung, G.
- 申请人： Aviza Technology, Inc.
- 申请人地址： 440 Kings Village Road Scotts Valley, CA 95066 US
- 专利权人： Aviza Technology, Inc.
- 当前专利权人： Aviza Technology, Inc.
- 当前专利权人地址： 440 Kings Village Road Scotts Valley, CA 95066 US
- 代理机构： Stoner, Gerard Patrick
- 优先权： US464458P 20030421; US520964P 20031117; US560952P 20040409
- 国际公布： WO2004105083 20041202
- 主分类号： C23C16/00
- IPC分类号： C23C16/00
摘要：
The present invention provides systems and methods for mixing vaporized precursors such that a mixture of vaporized precursors are present together in a chamber (102) during a single pulse step in an atomic layer deposition (ALD) process to form a multi-component film. The vaporized precursors are comprised of at least two different chemical components, and such different components will form a monolayer to produce a multi-component film. In a further aspect of the invention, a dielectric film having a composition gradient is provided.