基本信息:
- 专利标题： Method of mounting an electronic part on a mounting board
- 专利标题（中）：Methode zum Aufsetzen eines elektronisches Teils auf eine Montageplatte
- 申请号：EP04009746.1 申请日：2004-04-23
- 公开(公告)号：EP1471570A1 公开(公告)日：2004-10-27
- 发明人： Suga, Tadatomo , Itoh, Toshihiro , Nakazawa, Hideto , Akagawa, Masatoshi
- 申请人： Suga, Tadatomo , Shinko Electric Industries Co., Ltd. , Oki Electric Industry Co., Ltd. , Sharp Kabushiki Kaisha , Sony Corporation , Kabushiki Kaisha Toshiba , NEC CORPORATION , Hitachi, Ltd. , FUJITSU LIMITED , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MITSUBISHI DENKI KABUSHIKI KAISHA , Rohm Co., Ltd.
- 申请人地址： 3-6-3, Higashinakano, Nakano-ku Tokyo 164-0003 JP
- 专利权人： Suga, Tadatomo,Shinko Electric Industries Co., Ltd.,Oki Electric Industry Co., Ltd.,Sharp Kabushiki Kaisha,Sony Corporation,Kabushiki Kaisha Toshiba,NEC CORPORATION,Hitachi, Ltd.,FUJITSU LIMITED,MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,MITSUBISHI DENKI KABUSHIKI KAISHA,Rohm Co., Ltd.
- 当前专利权人： Suga, Tadatomo,Shinko Electric Industries Co., Ltd.,Oki Electric Industry Co., Ltd.,Sharp Kabushiki Kaisha,Sony Corporation,Kabushiki Kaisha Toshiba,NEC CORPORATION,Hitachi, Ltd.,FUJITSU LIMITED,MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,MITSUBISHI DENKI KABUSHIKI KAISHA,Rohm Co., Ltd.
- 当前专利权人地址： 3-6-3, Higashinakano, Nakano-ku Tokyo 164-0003 JP
- 代理机构： von Hellfeld, Axel, Dr. Dipl.-Phys.
- 优先权： JP2003120408 20030424
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/603 ; H01L23/485 ; H01L21/56 ; H01L21/48 ; H01L23/538 ; H01L21/00
摘要：
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
摘要（中）：
具有焊锡凸块（13）的封装（11）和具有由焊料材料制成的焊盘（17）的布线板（15）放置在真空或惰性气氛中，使凸块与相应的焊盘接触，而无需预处理 在正常温度下接合凸块和接合焊盘的表面以进行接合。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |