基本信息:
- 专利标题： POLYAMIDE RESIN COMPOSITION FOR FUSE DEVICE
- 专利标题（中）：聚酰胺树脂组合物控制装置
- 申请号：EP02720485.8 申请日：2002-04-18
- 公开(公告)号：EP1394214B1 公开(公告)日：2012-02-29
- 发明人： FUJIMOTO, Koji, UNITIKA LTD. , MURAKAMI, Iwao, Pacific Engineering Corp. , ANDOH, Hideki, Pacific Engineering Corp.
- 申请人： Pacific Engineering Corporation
- 申请人地址： 450 Hinoki-cho Ogaki-shi, Gifu-ken 503-0981 JP
- 专利权人： Pacific Engineering Corporation
- 当前专利权人： Pacific Engineering Corporation
- 当前专利权人地址： 450 Hinoki-cho Ogaki-shi, Gifu-ken 503-0981 JP
- 代理机构： Vossius & Partner
- 优先权： JP2001121086 20010419
- 国际公布： WO2002085984 20021031
- 主分类号： C08L77/00
- IPC分类号： C08L77/00 ; C08K3/34 ; C08K5/09 ; C08K7/04 ; H01H85/153 ; C08L77/02 ; C08L77/06
摘要：
A polyamide resin composition for a fuse device comprising 95 to 5 mass % of a poly amide copolymer (A) and 5 to 95 mass % of a polyamide homopolymer (B); the above polyamide resin composition for a fuse device which further comprises a silicate layer (C) comprising a swelling sheet silicate being dispersed therein in the molecular state defined in the specification, in a content of 0.1 to 20 mass %; and a fuse device which has a housing, a pair of terminals being projected from a given face of the housing and arranged in parallel, and a material capable of fusing connected between the base end sides of the terminals being housed in the housing, wherein the housing is made of the above polyamide resin composition.
公开/授权文献:
- EP1394214A1 POLYAMIDE RESIN COMPOSITION FOR FUSE DEVICE 公开/授权日：2004-03-03
IPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L77/00 | 由在主链中形成羧酸酰胺键合反应得到的聚酰胺的组合物；这些聚合物的衍生物的组合物 |