
基本信息:
- 专利标题: VERFAHREN UND VORRICHTUNG ZUM ERZEUGEN VON PROZESSGASEN
- 专利标题(英):Method and device for the production of process gases
- 专利标题(中):方法和设备进行用于产生工艺气体
- 申请号:EP02764065.5 申请日:2002-04-19
- 公开(公告)号:EP1382063A1 公开(公告)日:2004-01-21
- 发明人: ROTERS, Georg , MADER, Roland , SOMMER, Helmut , ERLIKH, Genrih , PASHUT, Yehuda
- 申请人: Mattson Thermal Products GmbH
- 申请人地址: Daimlerstrasse 10 89160 Dornstadt DE
- 专利权人: Mattson Thermal Products GmbH
- 当前专利权人: Mattson Thermal Products GmbH
- 当前专利权人地址: Daimlerstrasse 10 89160 Dornstadt DE
- 代理机构: Wagner & Geyer
- 优先权: DE10119741 20010423
- 国际公布: WO2002086958 20021031
- 主分类号: H01L21/316
- IPC分类号: H01L21/316
摘要:
The aim of the invention is the simple and economical production of a hydrogen-rich process gas from water vapour and hydrogen, whereby the proportion of water vapour to hydrogen may be precisely controllable and reproducible. Said aim is achieved, with a method and device for the production of a process gas for the treatment of substrates, in particular semiconductor substrates, in which the oxygen for formation of a process gas, comprising water vapour and hydrogen, is burnt in a hydrogen-rich environment in a combustion chamber.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的,例如腐蚀、抛光、切割 |
------------------H01L21/314 | ......无机层 |
--------------------H01L21/316 | .......由氧化物或玻璃状氧化物或以氧化物为基础的玻璃组成的无机层 |