发明公开
EP1341231A3 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
审中-公开
基本信息:
- 专利标题： System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
- 专利标题（中）：在集成电路封装的方法和用于堆叠的层的机械平坦化设备
- 申请号：EP03250539.8 申请日：2003-01-29
- 公开(公告)号：EP1341231A3 公开(公告)日：2006-07-19
- 发明人： Chiu, Anthony M. , Siegel, Harry Michael
- 申请人： STMicroelectronics, Inc.
- 申请人地址： 1310 Electronics Drive Carrollton Texas 75006-5039 US
- 专利权人： STMicroelectronics, Inc.
- 当前专利权人： STMicroelectronics, Inc.
- 当前专利权人地址： 1310 Electronics Drive Carrollton Texas 75006-5039 US
- 代理机构： Style, Kelda Camilla Karen
- 优先权： US66422 20020131
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A system and method is disclosed for providing mechanical planarization of a sequential build up substrate for an integrated circuit package. A planarization plate is placed in contact with an uneven external surface of a dielectric layer that covers underlying functional circuit elements and filler circuit elements. A heating element in the planarization plate flattens protruding portions of the external surface of the dielectric layer to create a flat external surface on the dielectric layer. After the flat external surface of the dielectric layer has cooled, it is then covered with a metal conductor layer. The method of the present invention increases the number of sequential buildup layers that may be placed on a sequential buildup substrate.
摘要（中）：
一种系统和方法被游离缺失盘在集成电路封装，用于提供连续的积聚基板的机械平坦化。 平坦化板被放置在接触上的介电层的不平坦的外表面做了下面的功能的电路元件和电路元件填料盖。 在平坦化板的加热元件变平突出的介电层的外部表面的部分，以在介电层上创建一个平坦的外表面。 该介电层的平坦外表面已经冷却之后，将其然后覆盖有金属导体层。 本发明的方法中增加顺序堆积层的数量也可以在连续的堆积基板进行放置。