基本信息:
- 专利标题： MODULAR CONNECTOR
- 专利标题（中）：模块化连接器
- 申请号：EP01965861 申请日：2001-08-07
- 公开(公告)号：EP1314226A4 公开(公告)日：2007-09-05
- 发明人： EMPLIT RAYMOND H
- 申请人： LEGRAND SNC
- 专利权人： LEGRAND SNC
- 当前专利权人： LEGRAND SNC
- 优先权： US22414900 2000-08-10
- 主分类号： H01R13/6466
- IPC分类号： H01R13/6466 ; H01R13/6473 ; H01R13/66 ; H01R24/00 ; H01R24/64 ; H01R33/945
摘要：
A modular connector (36) receivers a plug connector so that parallel contact portions of its paired conductors (38) provide a plane (40), behind which a circuit board (220) is provided with the connector (36). The conductors (38) connect to an external circuit, with inductive coupled cross talk minimized by arranging them in a non-parallel paired fashion. Capacitive coupled cross talk is minimized by the conductors (38) with free end portions connected to the circuit board (220) so that capacitor elements of the circuit board (220) also achieve cross talk compensation by reason of close spacing to the conductor contact portions.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01R | 导电连接；一组相互绝缘的电连接元件的结构组合；连接装置；集电器 |
| ------H01R13/00 | H01R12/14或H01R24/00至H01R33/00组中所包含的各种连接装置的零部件 |
| --------H01R13/62 | .用于便于接合或断开连接部件的装置或保持它们处于接合状态的装置 |
| ----------H01R13/6461 | ..用于防止串话的装置 |
| ------------H01R13/6464 | ...通过增加电容性元件 |
| --------------H01R13/6466 | ....在基底上，如PCBs |