![METHODS FOR PATTERNING POLYMER FILMS, AND USE OF THE METHODS](/ep/2002/04/03/EP1192505A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: METHODS FOR PATTERNING POLYMER FILMS, AND USE OF THE METHODS
- 专利标题(中):方法构建聚合物层和过程中的应用
- 申请号:EP00927984.5 申请日:2000-05-12
- 公开(公告)号:EP1192505A1 公开(公告)日:2002-04-03
- 发明人: INGANÄS, Olle , NYBERG, Tobias , GRANLUND, Tomas
- 申请人: Thin Film Electronics ASA
- 申请人地址: P.O. Box 1872 Vika 0124 Oslo NO
- 专利权人: Thin Film Electronics ASA
- 当前专利权人: Thin Film Electronics ASA
- 当前专利权人地址: P.O. Box 1872 Vika 0124 Oslo NO
- 代理机构: Sajda, Wolf E., Dipl.-Phys.
- 优先权: NO992295 19990512
- 国际公布: WO0070406 20001123
- 主分类号: G03F7/00
- IPC分类号: G03F7/00 ; B41M1/06 ; B81C1/00
摘要:
In a method for patterning a polymer film forming a coating on a material surface, a thin film of polymer is deposited on the surface and the patterning takes place by applying to the material surface a stamp made of an elastomeric material in conformal contact with the surface of the thin film, such that portions thereof contacting one or more protruding elements of the elastomeric stamp formed by one or more indentations thereof, are attached to the protruding element or elements and removed from the material surface with the stamp. In a method for transferring a patterned polymer film onto a material surface, a thin film polymer is deposited on a stamp surface and the stamp is applied in conformal contact with the material surface, such that thin film of polymer is transferred thereto from one or more protruding elements of the elastomeric stamp formed by at least one indentation thereof, thus leaving a patterned thin film of polymer on the material surface when removing the stamp therefrom. Use for patterning an etched resist in the form of a thin film of polymer on a gold layer.
公开/授权文献:
- EP1192505B1 METHODS FOR PATTERNING POLYMER FILMS, AND USE OF THE METHODS 公开/授权日:2006-07-19