发明公开
EP1133024A3 A header, a method of manufacture thereof and electronic device employing the same
审中-公开
基本信息:
- 专利标题： A header, a method of manufacture thereof and electronic device employing the same
- 专利标题（中）：，用于制造保持器和电子模块的方法相同的方法
- 申请号：EP01301722.3 申请日：2001-02-26
- 公开(公告)号：EP1133024A3 公开(公告)日：2003-11-12
- 发明人： Chen, Shiaw-Jong Steve , Hooey, Roger J.
- 申请人： LUCENT TECHNOLOGIES INC.
- 申请人地址： 600 Mountain Avenue Murray Hill, New Jersey 07974-0636 US
- 专利权人： LUCENT TECHNOLOGIES INC.
- 当前专利权人： LUCENT TECHNOLOGIES INC.
- 当前专利权人地址： 600 Mountain Avenue Murray Hill, New Jersey 07974-0636 US
- 代理机构： Buckley, Christopher Simon Thirsk
- 优先权： US523052 20000310
- 主分类号： H01R29/00
- IPC分类号： H01R29/00 ; H01R12/32 ; H01R12/22 ; H05K7/10
摘要：
A header (100) includes, in one embodiment, first (110) and second (120) contacts, and an intermediate body (130). The intermediate body includes an insulated section (135) interposed between the first and second contacts and has a cavity therein (140). The intermediate body also includes a semiconductor die (150), located within the cavity, adapted to condition a signal passing through at least a portion of the header.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01R | 导电连接；一组相互绝缘的电连接元件的结构组合；连接装置；集电器 |
| ------H01R29/00 | 以不同方法有选择地与一个配合件相连以接通不同电路的连接部件，例如用于电压选择，用于串联/并联选择 |