发明公开
EP1035758A4 ADHESIVE FOR ELECTROLESS PLATING, RAW MATERIAL COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING AND PRINTED WIRING BOARD
失效
基本信息:
- 专利标题： ADHESIVE FOR ELECTROLESS PLATING, RAW MATERIAL COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING AND PRINTED WIRING BOARD
- 专利标题（中）：KLEBSTOFF ZUR STROMLOSEN PLATTIERUNG，ROHSTOFFZUSAMMENSETZUNG ZUR HERSTELLUNG EINES KLEBSTOFFS ZUR STROMLOSEN PLATTIERUNG UND GEDRUCKTE LEITERPLATTE
- 申请号：EP98914030 申请日：1998-04-15
- 公开(公告)号：EP1035758A4 公开(公告)日：2000-11-15
- 发明人： ASAI MOTOO , ONO YOSHITAKA , KAWADE MASATO , NODA KOUTA , NISHIWAKI YOUKO
- 申请人： IBIDEN CO LTD
- 专利权人： IBIDEN CO LTD
- 当前专利权人： IBIDEN CO LTD
- 优先权： JP9773597 1997-04-15; JP15520197 1997-06-12; JP33546697 1997-12-05
- 主分类号： H05K3/38
- IPC分类号： H05K3/38 ; H05K3/46 ; H05K3/18 ; C09J201/00 ; C23C18/24
摘要：
An adhesive for electroless plating and a printed wiring board each being advantageous for securing insulation reliability between wires and between layers while keeping a practical peel strength. Specifically an adhesive for electroless plating prepared by dispersing cured heat-resistant resin particles soluble in an acid or an oxidizing agent in an uncured heat-resistant resin matrix which becomes slightly soluble in an acid or an oxidizing agent upon curing treatment, characterized in that the heat-resistant resin particles have a mean particle size of less than 2 νm and comprise fine particles and coarse particles; and a printed wiring board made by using this adhesive.
摘要（中）：
无电解电镀用粘接剂和印刷电路板在确保实用的剥离强度的同时，确保电线间和层间的绝缘可靠性。 具体地说，是一种通过将固化的耐酸树脂颗粒溶于酸或氧化剂中而制得的化学镀用粘合剂制备的，该固化耐热树脂颗粒在固化处理时在酸或氧化剂中微溶的未固化的耐热树脂基质中， 耐热树脂颗粒具有小于2νm的平均粒度并且包含细颗粒和粗颗粒; 以及使用该粘合剂制成的印刷线路板。
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/38 | .绝缘基片和金属之间黏合的改进 |