基本信息:
- 专利标题： DUAL SUBSTRATE, SINGLE-PASS PRINTING PROCESS
- 专利标题（中）：IN ONE PASS工作相关的打印一段双层底
- 申请号：EP95942458.1 申请日：1995-11-20
- 公开(公告)号：EP0794868B1 公开(公告)日：2000-02-16
- 发明人： SCHLEINZ, Robert, Joseph , CONRAD, Daniel, James , KUCHEROVSKY, Joseph, S.
- 申请人： KIMBERLY-CLARK WORLDWIDE, INC.
- 申请人地址： 401 North Lake Street Neenah, Wisconsin 54956 US
- 专利权人： KIMBERLY-CLARK WORLDWIDE, INC.
- 当前专利权人： KIMBERLY-CLARK WORLDWIDE, INC.
- 当前专利权人地址： 401 North Lake Street Neenah, Wisconsin 54956 US
- 代理机构： DIEHL GLAESER HILTL & PARTNER
- 优先权： US347983 19941202
- 国际公布： WO9616809 19960606
- 主分类号： B41F22/00
- IPC分类号： B41F22/00
摘要：
A dual substrate, single-pass printing process prints a high weight substrate (14) and a low basis weight substrate (12). Ink striking through the low basis weight substrate (12) is collected and absorbed by the high basis weight substrate (14). The printed substrates are then separated and rewound for subsequent transport and handling.
IPC结构图谱:
| B | 作业；运输 |
| --B41 | 印刷；排版机；打字机；模印机 |
| ----B41F | 印刷机械或印刷机 |
| ------B41F22/00 | 机器部件或印刷品的防玷污装置 |