基本信息:
- 专利标题： Device having resin package and method of producing the same
- 专利标题（中）：排列组成的树脂封装的及其制造方法
- 申请号：EP96308093.2 申请日：1996-11-07
- 公开(公告)号：EP0773584B1 公开(公告)日：2015-04-15
- 发明人： Yoneda, Yoshiyuki , Tsuji, Kazuto , Orimo, Seiichi , Sakoda, Hideharu , Nomoto, Ryuji , Onodera, Masanori , Kasai, Junichi
- 申请人： Fujitsu Semiconductor Limited
- 申请人地址： 2-10-23 Shin-Yokohama Kohoku-ku, Yokohama-shi Kanagawa 222-0033 JP
- 专利权人： Fujitsu Semiconductor Limited
- 当前专利权人： Fujitsu Semiconductor Limited
- 当前专利权人地址： 2-10-23 Shin-Yokohama Kohoku-ku, Yokohama-shi Kanagawa 222-0033 JP
- 代理机构： McCartney, Jonathan William
- 优先权： JP29013595 19951108; JP32280395 19951212; JP18383896 19960712; JP25070796 19960920; JP26760796 19961008
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/67 ; H01L23/00 ; H01L21/683 ; H01L29/06 ; H05K1/18 ; H05K3/30 ; H05K3/34 ; H01L23/31 ; H01L21/56 ; H01L25/10
摘要：
A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.
公开/授权文献:
- EP0773584A3 Device having resin package and method of producing the same 公开/授权日：2000-02-02