发明公开
EP0695732A2 Metallized ceramic substrate having smooth plating layer and method for producing the same
失效 - 权利终止
![Metallized ceramic substrate having smooth plating layer and method for producing the same](/ep/1996/02/07/EP0695732A2/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Metallized ceramic substrate having smooth plating layer and method for producing the same
- 专利标题(中):具有光滑镀层和制造方法的金属化陶瓷基板
- 申请号:EP95112029.4 申请日:1995-07-31
- 公开(公告)号:EP0695732A2 公开(公告)日:1996-02-07
- 发明人: Shimoda, Kouhei, c/o Itami Works of Sumimoto , Nakata, Hirohiko, c/o Itami Works of Sumimoto
- 申请人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: 5-33, Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541 JP
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: 5-33, Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541 JP
- 代理机构: Fiener, Josef
- 优先权: JP181310/94 19940802
- 主分类号: C04B41/90
- IPC分类号: C04B41/90
摘要:
A metallized ceramic substrate having a smooth plating layer, comprising a ceramic substrate comprising aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate and a nickel-based plating layer which is formed on the metallized layer and has a thickness of not greater than 2 µm and a surface roughness (Ra) of not greater than 2 µm. In another aspect, the plating layer may be constituted of a first nickel-based plating layer and a second gold-based plating layer in which the first plating layer and the second plating layer have a thickness of not greater than 2 µm and a thickness of not greater than 1 µm, respectively, and the surface roughness (Ra) of the second layer should be 2 µm or less. These metallized substrates are produced by applying a metallizing paste of W and/or Mo onto a green AlN ceramic substrate, flattening, firing and forming the foregoing plating layer or layers.
公开/授权文献:
IPC结构图谱:
C | 化学;冶金 |
--C04 | 水泥;混凝土;人造石;陶瓷;耐火材料 |
----C04B | 石灰;氧化镁;矿渣;水泥;其组合物,例如砂浆、混凝土或类似的建筑材料;人造石;陶瓷;耐火材料;天然石的处理 |
------C04B41/00 | 砂浆、混凝土、人造石或陶瓷的后处理;天然石的处理 |
--------C04B41/60 | .仅对人造石的 |
----------C04B41/81 | ..涂覆或浸渍 |
------------C04B41/82 | ...用有机材料 |
--------------C04B41/90 | ....至少有一层是金属 |