基本信息:
- 专利标题： Method of connection testing electronic boards
- 专利标题（中）：连接测试电子板的方法
- 申请号：EP93108451.1 申请日：1993-05-25
- 公开(公告)号：EP0571963A3 公开(公告)日：1994-04-13
- 发明人： Bonaria, Luciano
- 申请人： SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione
- 申请人地址： Via Torino, 16 I-10088 Volpiano IT
- 专利权人： SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione
- 当前专利权人： SPEA S.r.l. Sistemi per l'Elettronica e l'Automazione
- 当前专利权人地址： Via Torino, 16 I-10088 Volpiano IT
- 代理机构： Cerbaro, Elena
- 优先权： ITTO920463 19920529
- 主分类号： G01R31/04
- IPC分类号： G01R31/04 ; G01R31/28
摘要：
A method based on the observation that the clamping diodes (4, 8) between pins (2, 3) having similar functional characteristics form multicollector structures, which, when biased, supply comparable collector currents in the event of correct connection. The method therefore comprises stages consisting in grouping (30) the clamping diodes (4, 8) according to function or structure; biasing (32) the resulting multiterminal structures (10) so as to produce currents (I Ci ); measuring (33) the currents; comparing (35, 36) the measured currents; and detecting (36, 37) faulty connections on the basis of marked variations in the currents.
摘要（中）：
基于观察到具有相似功能特征的引脚（2,3）之间的钳位二极管（4,8）形成多集电极结构的方法，所述多集电极结构在被偏置时在正确连接的情况下提供可比较的集电极电流。 因此该方法包括根据功能或结构对钳位二极管（4,8）进行分组（30）的阶段; 偏置（32）所得到的多端结构（10）以产生电流（ICi）; 测量（33）电流; 比较（35,36）所测量的电流; 并根据电流的明显变化检测（36,37）故障连接。
公开/授权文献:
- EP0571963B1 Method of connection testing electronic boards 公开/授权日：1998-08-26