基本信息:
- 专利标题： Aromatic allyl amine thermosetting resin composition
- 专利标题（中）：芳香聚氨酯热固性树脂组合物
- 申请号：EP90400033.8 申请日：1990-01-05
- 公开(公告)号：EP0378457A3 公开(公告)日：1991-10-09
- 发明人： Naitoh, Shigeki , Saito, Yasuhisa , Hirano, Yasuhiro , Takebe, Kazuo , Kamio, Kunimasa , Ueda, Youichi
- 申请人： SUMITOMO CHEMICAL COMPANY, LIMITED
- 申请人地址： 5-33, Kitahama 4-chome Chuo-ku Osaka JP
- 专利权人： SUMITOMO CHEMICAL COMPANY, LIMITED
- 当前专利权人： SUMITOMO CHEMICAL COMPANY, LIMITED
- 当前专利权人地址： 5-33, Kitahama 4-chome Chuo-ku Osaka JP
- 代理机构： Bourgognon, Jean-Marie
- 优先权： JP6894/89 19890112; JP73054/89 19890323; JP162099/89 19890622; JP161292/89 19890623
- 主分类号： C08G73/12
- IPC分类号： C08G73/12 ; C08F283/04 ; B32B15/08 ; C07C217/90 ; C07C323/37
摘要：
A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula:
wherein Ar is a divalent aromatic residue, and R₁, R₂, R₃ and R₄ each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
wherein Ar is a divalent aromatic residue, and R₁, R₂, R₃ and R₄ each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
公开/授权文献:
- EP0378457B1 Aromatic allyl amine thermosetting resin composition 公开/授权日：1994-08-03
IPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08G | 用碳—碳不饱和键以外的反应得到的高分子化合物 |
| ------C08G73/00 | 不包括在C08G12/00到C08G71/00组内的，在高分子主链中形成含氮的键合，有或没有氧或碳键合反应得到的高分子化合物 |
| --------C08G73/02 | .聚胺 |
| ----------C08G73/10 | ..聚酰亚胺；聚酯-酰亚胺；聚酰胺-酰亚胺；聚酰胺酸或类似的聚酰亚胺的母体 |
| ------------C08G73/12 | ...不饱和聚酰亚胺母体 |