基本信息:
- 专利标题：
- 申请号：DE69430829 申请日：1994-02-24
- 公开(公告)号：DE69430829T2 公开(公告)日：2002-10-10
- 发明人： SCHAPER LEONARD W
- 申请人： UNIV ARKANSAS
- 专利权人： UNIV ARKANSAS
- 当前专利权人： UNIV ARKANSAS
- 优先权： US2461693 1993-03-01
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/52 ; H01L23/538 ; H01L25/04 ; H01L25/18 ; H05K1/00
摘要：
An electrical interconnection medium having a plurality of first conductive regions arranged in first and second layers and interconnected to form a first offset mesh plane of a first electrical potential and a signal path comprising at least a selected isolated portion of at least one of the first conductive regions which selected portion would otherwise be a part of the offset mesh plane.
公开/授权文献:
- DE69430829D1 公开/授权日：2002-07-25
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |