基本信息:
- 专利标题： Verfahren und Vorrichtungen zur Positionierung von Nanoobjekten
- 申请号：DE112013001196 申请日：2013-04-25
- 公开(公告)号：DE112013001196B4 公开(公告)日：2016-04-14
- 发明人： DUERIG URS T , HOLZNER FELIX , KNOLL ARMIN W , RIESS WALTER HEINRICH
- 申请人： IBM
- 专利权人： IBM
- 当前专利权人： IBM
- 优先权： GB201207463 2012-04-30
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; B82B3/00 ; B82Y40/00 ; C25D13/02
A method for positioning nano-objects on a surface and an apparatus for implementing the method. The method includes: providing a first surface and a second surface in a position facing each other, where one or more of the surfaces exhibits one or more position structures having dimensions on the nanoscale; providing an ionic liquid suspension of the nano-objects between the two surfaces, where the suspension comprises two electrical double layers each formed at an interface with a respective one of the two surfaces, and the surfaces have electrical charges of the same sign; enabling the nano-objects in the suspension to position according to a potential energy resulting from the electrical charge of the two surfaces; and depositing one or more of the nano-objects on the first surface according to the positioning structures by shifting the minima of the potential energy towards the first surface.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
| ------------H01L21/768 | ...利用互连在器件中的分离元件间传输电流 |