基本信息:
- 专利标题： 一种融合SMT工序的SIP封装生产流水线
- 专利标题（英）：SIP packaging production line fusing SMT procedures
- 申请号：CN201821475447.4 申请日：2018-09-10
- 公开(公告)号：CN209133461U 公开(公告)日：2019-07-19
- 发明人： 袁野 , 全庆霄 , 姜岩峰 , 王辉 , 王嫚
- 申请人： 无锡豪帮高科股份有限公司
- 申请人地址： 江苏省无锡市胡埭镇胡阳路1号
- 专利权人： 无锡豪帮高科股份有限公司
- 当前专利权人： 无锡豪帮高科股份有限公司
- 当前专利权人地址： 江苏省无锡市胡埭镇胡阳路1号
- 代理机构： 北京中济纬天专利代理有限公司
- 代理人： 赵海波; 曹键
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/373 ; H05K3/34
The utility model relates to an SIP packaging production line fused with an SMT process. The device is characterized by sequentially comprising a lead frame feeding device (101) from front to back, asteel mesh printing device (102), a first AOI automatic optical detection device (103), an active device mounting device (104), a passive device mounting device (105), the device comprises a reflow soldering device (106), a second AOI automatic optical detection device (107), a chip mounting device (108), a first baking device (109), a bonding device (110), a plastic packaging device (111), a second baking device (112), a marking device (113), an electroplating device (114), a forming and rib cutting device (115) and an appearance detection packaging device (116). The SIP packaging productionline fused with the SMT process has the advantages of improving production efficiency, reducing production cost and guaranteeing quality of produced products.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |