The utility model discloses a semiconductor power module 3D encapsulates structure includes a cellular at least, the cellular includes insulating layer, lower insulative layer, set up the chip subassembly between last insulating layer and lower insulative layer and be used for the fixed electrode subassembly who goes up insulating layer and lower insulative layer and regard as the electrode, unit's cell type structure arbitrary serial and parallel structure of circuit topology that can relax, the connection in series -parallel equally also can be realized to the unit that first cell type structural grouping formed, very big reduction conception modulaire's the degree of difficulty, the chip need not weld and the bonding line, and use metal checkpost can effectively reduce the parasitic parameter in return circuit as the conductive medium of electric current, the three -dimensional overall arrangement of 3D can effectively reduce the volume of module, carries high power density, it is concentrated that the unitized design of unit's cell type structure can avoid the connection in series -parallel of multicore piece to generate heat, the difficult problem of heat dissipation, and three -dimensional overall arrangement is favorable to the heat dissipation of module.