![一种电力建设工程样品检测电子标签装置](/CN/2016/2/175/images/201620875074.jpg)
基本信息:
- 专利标题: 一种电力建设工程样品检测电子标签装置
- 专利标题(英):Electric power construction engineering sample test electronic tags device
- 申请号:CN201620875074.4 申请日:2016-08-12
- 公开(公告)号:CN206039598U 公开(公告)日:2017-03-22
- 发明人: 邵广伟 , 杨玉俭 , 郑鹏 , 李红星 , 张运山 , 纪忠军 , 张雷 , 刘国福 , 侯文明 , 王磊 , 杨光 , 魏巍 , 佟凤楠 , 王雷 , 刘金剑 , 李令远 , 铁金越 , 唐颖 , 王植宇 , 张福生
- 申请人: 辽宁电力建设监理有限公司
- 申请人地址: 辽宁省沈阳市和平区太原南街224号
- 专利权人: 辽宁电力建设监理有限公司
- 当前专利权人: 辽宁电力建设监理有限公司
- 当前专利权人地址: 辽宁省沈阳市和平区太原南街224号
- 代理机构: 沈阳世纪蓝海专利事务所
- 代理人: 侯志奇
- 主分类号: G06K19/077
- IPC分类号: G06K19/077 ; G06Q50/06
The utility model provides an electric power construction engineering sample test electronic tags device, does include RF 508 chip, antenna, NF the C03 chip, RF 508 the chip passes through P0.1Cin2B, with the R7 ohmic connection, obtains from the stabilizing the voltage of DS1 diode transmission, RF 508 chip P0.4Cin1A connects R6 resistance and R5 resistance, acquires working power supply, RF 508 be the P1.3INT0 of chip, P1.2T0 with NF SCL, the SDA of C03 chip connect, accomplish data communication transmission and transmission between the chip, NF the VDD of C03 chip is connected with C5, and C5 ohmic connection 0.22F fuse guarantees that mains operated is stable, be connected with the C2 condenser simultaneously, carry out filtering through the C2 condenser and handle. The utility model discloses an adopt RFID technique and NFC technique, carry out identity to electric power construction engineering sample, paste on electric power construction engineering sample and bind electronic tags, can take notes sample serial number, name code and the type code of electric power construction engineering sample, be applied to among the electric power construction engineering technical field.
IPC结构图谱:
G | 物理 |
--G06 | 计算;推算;计数 |
----G06K | 数据识别;数据表示;记录载体;记录载体的处理 |
------G06K19/00 | 连同机器一起使用的记录载体,并且至少其中一部分设计带有数字标记 |
--------G06K19/06 | .按数字标记的种类区分的,例如,形状、性质、代码 |
----------G06K19/067 | ..带有导电标记、印刷电路或半导体电路元件的记录载体,例如,信用卡或识别卡 |
------------G06K19/07 | ...带有集成电路芯片 |
--------------G06K19/077 | ....结构的细节,例如,在该载体中电路的装配 |