The utility model relates to the hybrid integrated circuit power chip three-dimensional soldering interconnection technology, and concretely relates to a power chip interconnection structure. The interconnection structure comprises a power chip, a transition sheet metal and a copper belt or a copper frame. An interconnection method comprises the transition sheet metal is soldered on the power chip, and soldering interconnection of the power chip and the copper belt on a substrate is realized through the transition metal sheet. According to the power chip interconnection structure provided by the utility model, interconnection in a graded soldering manner is adopted, low power consumption interconnection of the power chip of a hybrid integrated circuit can be realized, the interconnection reliability is also raised through copper structure interconnection, and the structure is simple, and easy to assemble.