基本信息:
- 专利标题： 基板和电路板
- 专利标题（英）：Substrate and circuit board
- 申请号：CN201320563850.3 申请日：2013-09-11
- 公开(公告)号：CN203554777U 公开(公告)日：2014-04-16
- 发明人： 陈德福 , 陈臣 , 车世民
- 申请人： 北大方正集团有限公司 , 珠海方正科技高密电子有限公司 , 方正信息产业控股有限公司
- 申请人地址： 北京市海淀区成府路298号方正大厦9层
- 专利权人： 北大方正集团有限公司,珠海方正科技高密电子有限公司,方正信息产业控股有限公司
- 当前专利权人： 新方正控股发展有限责任公司,珠海方正科技高密电子有限公司
- 当前专利权人地址： 北京市海淀区成府路298号方正大厦9层
- 代理机构： 北京友联知识产权代理事务所
- 代理人： 梁朝玉; 尚志峰
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
The utility model provides a substrate and a circuit board. The substrate provided by the utility model is used for making the circuit board. An edge of a board, which is used for metal plating, of the substrate is provided with a chamfer. The height of the chamfer is not less than 0.01 mm. The substrate provided by the utility model can eliminate a problem that a metal coating at a tip of the circuit board or the board edge is thickened, a problem that there are burrs, or a problem of scorching, and other problems, wherein the above problems in a metal-plating process are caused by the point effect which is generated at the board edge of the circuit board, thereby guaranteeing the normal exposure and etching of the metal coating of the circuit board, and promoting circuit boards to develop towards the high-level direction.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |