基本信息:
- 专利标题： 微电子成像器的覆盖物及微电子成像器的晶片级封装方法
- 专利标题（英）：Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers
- 申请号：CN200580023850.2 申请日：2005-04-27
- 公开(公告)号：CN1985379B 公开(公告)日：2010-05-05
- 发明人： 姜彤弻 , J·M·布鲁克斯
- 申请人： 微米技术有限公司
- 申请人地址： 美国爱达荷州
- 专利权人： 微米技术有限公司
- 当前专利权人： 普廷数码影像控股公司
- 当前专利权人地址： 美国爱达荷州
- 代理机构： 中国专利代理(香港)有限公司
- 代理人： 张雪梅; 王忠忠
- 优先权： 10/845,304 2004.05.13 US
- 国际申请： PCT/US2005/014632 2005.04.27
- 国际公布： WO2005/114750 EN 2005.12.01
- 进入国家日期： 2007-01-15
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203
Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensorare disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors. The first substrate is then cut to singulate the individual covers, after which the second substrate is cut to singulate individual imaging units.
公开/授权文献:
- CN1985379A 微电子成像器的覆盖物及微电子成像器的晶片级封装方法 公开/授权日：2007-06-20