
基本信息:
- 专利标题: 半固化片的环氧树脂组合物及其用途
- 专利标题(英):Epoxy composite of semi-solidified sheet and its use
- 申请号:CN200610096860.5 申请日:2006-10-23
- 公开(公告)号:CN1955219A 公开(公告)日:2007-05-02
- 发明人: 高延敏 , 王鹏
- 申请人: 江苏科技大学
- 申请人地址: 江苏省镇江市学府路江苏科技大学
- 专利权人: 江苏科技大学
- 当前专利权人: 江苏科技大学
- 当前专利权人地址: 江苏省镇江市学府路江苏科技大学
- 代理机构: 南京经纬专利商标代理有限公司
- 代理人: 楼高潮
- 主分类号: C08L63/02
- IPC分类号: C08L63/02 ; C08K5/3472 ; C09J163/02 ; B32B37/12
This invention is an epoxide resin composite, and its feature is that benzene vinyl-Maleic Anhydride interpolymer, 2-methyl glyoxaline and solvent are added into epoxide resin according a certain proportion. Its components weight amount is that epoxide resin 10-79.99%, SMA interpolymer 10-74%, 2-methyl glyoxaline 0.01-6%. The solvent is dimethylformamide(DMF), and its weight amount is 10%. The feature of this invention is that when epoxide resin composite solidifies, SMA is not only the curing agent of the composite, but also contributes to the formation of network structure of the solidified product. This solidified product overcomes the fragibility of present epoxide resin solidification, and improve its wet fastness,tenacity and heat stability. This epoxide resin composite can be used in the production of binding agent and laminated wood of composite multilayer electric circuit panel.
IPC结构图谱:
C | 化学;冶金 |
--C08 | 有机高分子化合物;其制备或化学加工;以其为基料的组合物 |
----C08L | 高分子化合物的组合物 |
------C08L63/00 | 环氧树脂的组合物;环氧树脂衍生物的组合物 |
--------C08L63/02 | .双酚的聚缩水甘油醚类 |