基本信息:
- 专利标题： 电子电路的连接结构及其连接方法
- 专利标题（英）：Electronic circuit connection structure and its connection method
- 申请号：CN200410044664.4 申请日：2004-05-19
- 公开(公告)号：CN1551712B 公开(公告)日：2010-08-18
- 发明人： 东田隆亮 , 山本宪一 , 末次大辅 , 长冈美行 , 今中崇 , 新田敏也
- 申请人： 松下电器产业株式会社
- 申请人地址： 日本大阪府
- 专利权人： 松下电器产业株式会社
- 当前专利权人： 松下电器产业株式会社
- 当前专利权人地址： 日本大阪府
- 代理机构： 中科专利商标代理有限责任公司
- 代理人： 汪惠民
- 优先权： 2003-140162 2003.05.19 JP
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H05K3/36
A connecting structure comprises a circuit board (10) with a first connection land (12) having a plurality of conductor patterns on the surface thereof, a second connection land (24) disposed in a position opposite to the first connection land (12) of the circuit board (10), and a flexible board (20) including an insulating layer (26) formed so as to surround at least a part of outer periphery ofthe second connection land (24), wherein the first connection land (12) and the second connection land (24) are bonded to each other with a bonding member (30), and the insulating layer (26) is thicker than the total thickness of the second connection land (24) and the first connection land (12). It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.
公开/授权文献:
- CN1551712A 电子电路的连接结构及其连接方法 公开/授权日：2004-12-01
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/14 | ..两个或更多个印刷电路的结构连接 |