
基本信息:
- 专利标题: 可除去的压敏粘合片
- 专利标题(英):Removable pressure-sensitive adhesive sheet
- 申请号:CN00137282.3 申请日:2000-12-14
- 公开(公告)号:CN1303899A 公开(公告)日:2001-07-18
- 发明人: 山本孝幸 , 樽野友浩 , 渡边敬介 , 松村健
- 申请人: 日东电工株式会社
- 申请人地址: 日本大阪府
- 专利权人: 日东电工株式会社
- 当前专利权人: 日东电工株式会社
- 当前专利权人地址: 日本大阪府
- 代理机构: 中国专利代理(香港)有限公司
- 代理人: 庞立志; 杨九昌
- 优先权: 355190/1999 1999.12.14 JP; 261963/2000 2000.08.30 JP
- 主分类号: C09J7/02
- IPC分类号: C09J7/02
A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 10<5> or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.
公开/授权文献:
- CN1227314C 可除去的压敏粘合片 公开/授权日:2005-11-16
IPC结构图谱:
C | 化学;冶金 |
--C09 | 染料;涂料;抛光剂;天然树脂;黏合剂;其他类目不包含的组合物;其他类目不包含的材料的应用 |
----C09J | 黏合剂;一般黏合方法(非机械部分);其他类目不包括的黏合方法;黏合剂材料的应用 |
------C09J7/00 | 薄膜或薄片状的黏合剂 |
--------C09J7/02 | .在载体上 |