The invention discloses a transfer method of a Micro-LED chip. The transfer method comprises the following steps of: (1) carrying out surface charge treatment on a chip; (2) presetting an electrode array on a transfer substrate, immersing the chip in a first solution, immersing the transfer substrate and an electrode into the first solution, connecting one of the transfer substrate and the electrode with a positive electrode of a power supply, and connecting the other one of the two with the negative electrode of the power supply, wherein the transfer substrate and the chip have opposite charges; (3) electrifying the power supply, wherein chips distributed in an array manner are adsorbed on the electrode array on the transfer substrate; (4) inversely mounting the transfer substrate and a bearing substrate to align the chip on the transfer substrate with the bonding pad on the bearing substrate; (5) separating the chip from the surface of the transfer substrate, and transferring the chip to the bonding pad of the bearing substrate; and (6) repeating the above steps, and sequentially transferring the chips with various shapes to the same bearing substrate. According to the transfer method of a Micro-LED chip, huge transfer of three-primary-color Micro-LED chips is achieved, and the operation is simple, so that the production efficiency is improved, and the production cost is reduced.