![腔室内衬、工艺腔室和半导体处理设备](/CN/2018/1/98/images/201810493616.jpg)
基本信息:
- 专利标题: 腔室内衬、工艺腔室和半导体处理设备
- 专利标题(英):Chamber lining, processing chamber and semiconductor processing equipment
- 申请号:CN201810493616.5 申请日:2018-05-22
- 公开(公告)号:CN110512178A 公开(公告)日:2019-11-29
- 发明人: 邱国庆 , 赵梦欣 , 白志民 , 王厚工 , 丁培军
- 申请人: 北京北方华创微电子装备有限公司
- 申请人地址: 北京市北京经济技术开发区文昌大道8号
- 专利权人: 北京北方华创微电子装备有限公司
- 当前专利权人: 北京北方华创微电子装备有限公司
- 当前专利权人地址: 北京市北京经济技术开发区文昌大道8号
- 代理机构: 北京天昊联合知识产权代理有限公司
- 代理人: 彭瑞欣; 姜春咸
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; H01L21/67
The invention discloses a chamber lining, a processing chamber and semiconductor processing equipment. The chamber lining is used for forming a processing space inside the processing chamber, whereinthe processing space is used for limiting the distribution of plasma; the chamber lining comprises a first fence part, a transition connecting part and a second fence part, wherein the transition connecting part extends in a bending manner from the first fence part to the processing space; the second fence part extends in a bending manner from the transition connecting part to a direction oppositeto the first fence part; the first fence part, the transition connecting part and the second fence part together form the processing space; and the transition connecting part is provided with a firstaccommodating structure used for effectively collecting particle impurities generated inside the processing chamber so that the particle impurities can be prevented from falling to the surface of a silicon wafer inside the processing chamber, and therefore the processing yield of the silicon wafer is increased and the manufacturing cost is reduced.
公开/授权文献:
- CN110512178B 腔室内衬、工艺腔室和半导体处理设备 公开/授权日:2021-08-13