The invention relates to the technical field of packaging and provides a packaging structure based on quantum dots. The packaging structure comprises a lamp source plate and a plurality of chips arranged on the lamp source plate. The packaging structure also comprises quantum dots and a photoresist layer having adsorption capacity for the quantum dots. The photoresist layer is arranged on the light emitting sides of the chips; a plurality of through grooves are formed in the photoresist layer; the through grooves and the chips are arranged in a one-to-one correspondence mode; the top ends of the chips are connected with the bottom ends of the through grooves and seal the bottom ends of the through grooves; and the quantum dots are arranged at the top ends of the chips in a coating mode andcontained in the through grooves. The invention also provides a display which comprises the packaging structure based on the quantum dots. The photoresist layer with the through grooves is arranged on the chips, the chips and the through grooves are arranged in the one-to-one correspondence manner, and the top ends of the chips are connected with and seal the bottom ends of the through grooves, so that the adsorption force of the side walls of the through grooves can effectively balance the fluid force of the quantum dots, the coffee ring effect is eliminated, the quantum dots in the throughgrooves are more uniformly distributed, and uniform color display is realized.