The invention discloses a rapid positioning method for observing the microstructure of a designated area of a transparent wafer. The method includes the steps: 1 positioning a specific area of the transparent wafer with the known microstructure and performing other research on the position; 2 observing the microstructure of the designated area of the transparent wafer at known positioning coordinates. Coordinate objects designed by the method are squares formed by transverse lines and vertical lines, the squares are filled in with position codes, and the edge length sizes of the squares are set according to an area needing observation or a microscope observation area, and the coordinate objects are bearing materials made of printing paper or other materials which can be shaped, recorded and marked. The method has universality, the newly developed coordinate objects can be used under the microscope, geometric coordinates are calculated through the coordinate objects at the position observed under the microscope to realize accurate positioning, working time and unnecessary workload are reduced, damage and contamination caused by marking on the surface of a sample, and the method hasremarkable practicability for scientific research non-standard products.