The invention discloses an elastic heat conduction structure, and the structure comprises a circuit board, a heat dissipation device and a to-be-cooled module mounted on the circuit board. The elasticheat conduction structure further comprises an elastic heat conduction assembly and a heat conduction piece, and the elastic heat conduction assembly comprises a heat conduction pad and elastic elements arranged on the two sides of the heat conduction pad. The elastic heat conduction assembly and the heat conduction piece are clamped between the to-be-cooled module and the heat dissipation device. The elastic heat conduction assembly is in heat conduction connection with the heat conduction piece and the heat dissipation device, and the heat conduction piece is in heat conduction connection with the to-be-cooled module. Through the application of the heat dissipation module, an elastic pressing force exists among the elastic heat conduction assembly, the heat conduction piece, the to-be-cooled module and the heat dissipation device through the elastic elements, the heat resistance is reduced, and the to-be-cooled module can efficiently transfer heat to the large heat dissipation pieceor a heat dissipation metal shell of a product.