基本信息:
- 专利标题： 研磨体及其制造方法
- 专利标题（英）：POLISHING BODY AND MANUFACTURING METHOD THEREFOR
- 申请号：CN201780043156.X 申请日：2017-07-10
- 公开(公告)号：CN109475995A 公开(公告)日：2019-03-15
- 发明人： 大森恒 , 山口贵哉 , 北岛将太 , 佐藤诚
- 申请人： 株式会社 , 则武
- 申请人地址： 日本爱知县
- 专利权人： 株式会社,则武
- 当前专利权人： 株式会社,则武
- 当前专利权人地址： 日本爱知县
- 代理机构： 北京市中咨律师事务所
- 代理人： 王潇悦; 段承恩
- 优先权： 2016-138049 2016.07.12 JP
- 国际申请： PCT/JP2017/025178 2017.07.10
- 国际公布： WO2018/012468 JA 2018.01.18
- 进入国家日期： 2019-01-11
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; H01L21/304 ; B24D3/32 ; B24D3/00 ; B24D11/00
Provided is a polishing body (LHA pad) which is used for polishing by a CMP method and which is capable of achieving stable polishing performance and uniformly polishing a workpiece. Also provided isa manufacturing for the polishing body. The polishing body (10) comprises a matrix resin (12) and multiple polishing particles (14) and is formed into a disc-like shape having a plurality of vertically-long pores (18). The matrix resin (12) is provided with communication holes (16) which are in communication with the vertically-long pores (18) and with each other. The interior of each of the communication holes (16) is provided with at least one or more polishing particles (14). The mean diameter of the communication holes (16) is no more than 18 times that of the polishing particles (14). Since the polishing body (10) stably encapsulates polishing particles (14) in communication holes (16) during polishing and has vertically-long pores (18), the polishing body (10) is able to achieve stable polishing performance and can uniformly polish a workpiece.
公开/授权文献:
- CN109475995B 研磨体及其制造方法 公开/授权日：2021-11-05
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B37/00 | 研磨机床或装置，即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料；及其附件 |
| --------B24B37/005 | .研磨机床或装置的控制装置 |
| ----------B24B37/12 | ..用于加工平面的研磨片 |
| ------------B24B37/24 | ...以垫的材料成分或特性为特征 |