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基本信息:
- 专利标题: 单片硅基光电集成芯片的制备方法
- 申请号:CN201811453417.8 申请日:2018-11-30
- 公开(公告)号:CN109459817B 公开(公告)日:2020-01-07
- 发明人: 王俊 , 成卓 , 杨泽园 , 尹海鹰 , 张翼东 , 杨明 , 黄永清 , 任晓敏
- 申请人: 北京邮电大学
- 申请人地址: 北京市海淀区西土城路10号北京邮电大学
- 专利权人: 北京邮电大学
- 当前专利权人: 北京邮电大学
- 当前专利权人地址: 北京市海淀区西土城路10号北京邮电大学
- 代理机构: 北京路浩知识产权代理有限公司
- 代理人: 王莹; 吴欢燕
- 主分类号: G02B6/136
- IPC分类号: G02B6/136
The embodiment of the invention provides a preparation method of a monolithic silicon-based photoelectric integrated chip. A laser device structure grows by etching a pattern window on an SOI substrate, a detector structure grows on a silicon waveguide layer in the SOI substrate, and a laser device and a detector are connected through the etched silicon waveguide structure, so that integration ofthe on-chip laser device, the detector and the silicon waveguide structure is achieved. According to the preparation method of the monolithic silicon-based photoelectric integrated chip, the laser device structure grows by directly etching the pattern window, high repeatability and reliability are achieved, large-scale preparation can be achieved, the cost is greatly reduced, good application prospects are achieved, the blank that a practical on-chip photoelectric integration cannot be achieved through a direct selective area epitaxy mode at present is made up for, and the method particularlysolves the on-chip integration problem of the laser device and other devices.
公开/授权文献:
- CN109459817A 单片硅基光电集成芯片的制备方法 公开/授权日:2019-03-12
IPC结构图谱:
G | 物理 |
--G02 | 光学 |
----G02B | 光学元件、系统或仪器 |
------G02B6/00 | 光导;包含光导和其他光学元件(如耦合器)的装置的结构零部件 |
--------G02B6/02 | .带有包层的光导纤维 |
----------G02B6/12 | ..集成光路类型 |
------------G02B6/13 | ...以制作方法为特征的集成光路 |
--------------G02B6/136 | ....用蚀刻法 |