![一种香精偶联纸张的制备方法](/CN/2018/1/204/images/201811023019.jpg)
基本信息:
- 专利标题: 一种香精偶联纸张的制备方法
- 专利标题(英):Method for preparing essence coupled paper
- 申请号:CN201811023019.2 申请日:2018-09-04
- 公开(公告)号:CN109137604A 公开(公告)日:2019-01-04
- 发明人: 陈正宇 , 张爱斌 , 胡海清
- 申请人: 扬州市祥华新材料科技有限公司
- 申请人地址: 江苏省扬州市高邮市高邮镇工业园卫星路1号
- 专利权人: 扬州市祥华新材料科技有限公司
- 当前专利权人: 扬州市祥华新材料科技有限公司
- 当前专利权人地址: 江苏省扬州市高邮市高邮镇工业园卫星路1号
- 代理机构: 常州兴瑞专利代理事务所
- 代理人: 谈敏
- 主分类号: D21H17/68
- IPC分类号: D21H17/68 ; D21H17/67 ; D21H21/14 ; D21F13/00 ; D21H27/10
The invention belongs to the technical field of papermaking, and relates to a method for preparing essence coupled paper. The method includes preparing preliminary paper pulp with the solid content of20-70 g/m<3> by conventional technical means in the industry, and mechanically stirring, by weight, 60-95 parts of preliminary paper pulp, 0.5-10 parts of coupling agents and 0.01-5 parts of auxiliaries for 0.5-4 h to obtain pre-coupled paper pulp; mechanically stirring, by weight, 60-95 parts of pre-coupled paper pulp and 0.5-8 parts of essence or aromatic for 0.2-3 h to obtain essence coupled paper pulp; ultimately preparing the essence coupled paper by conventional technical means in the industry. The method has the advantages that the essence and the aromatic are implanted in paper main structures in coupling modes, the essence and the aromatic which are implanted in the paper main structures by means of coupling are high in attachment fastness as compared with existing essence and existing aromatic which are traditionally smeared on the surfaces of paper, the acid and alkali resistance can be obviously improved, and adhesion of stacked paper can be prevented after the stacked paper is heated; the essence and the aromatic in the essence coupled paper are long in retention time and rarely can be affected by the temperatures or the humidity.
IPC结构图谱:
D | 纺织;造纸 |
--D21 | 造纸;纤维素的生产 |
----D21H | 浆料或纸浆组合物;不包括在小类D21C、D21D中的纸浆组合物的制备;纸的浸渍或涂布;不包括在大类B31或小类D21G中的成品纸的加工;其他类不包括的纸 |
------D21H17/00 | 添加到纸浆的非纤维材料,特征在于其组分;特征在于其组分的纸浸渍材料 |
--------D21H17/63 | .无机化合物 |
----------D21H17/67 | ..水不溶性化合物,如填料、颜料 |
------------D21H17/68 | ...含硅的,如黏土 |