![一种具有模内封装件的连接器及其注塑封装方法](/CN/2018/1/185/images/201810929304.jpg)
基本信息:
- 专利标题: 一种具有模内封装件的连接器及其注塑封装方法
- 专利标题(英):A connector having an in-mold package and an injection molding package method thereof
- 申请号:CN201810929304.4 申请日:2018-08-15
- 公开(公告)号:CN109038051A 公开(公告)日:2018-12-18
- 发明人: 宋璐 , 陈军 , 李建华
- 申请人: 富加宜连接器(东莞)有限公司
- 申请人地址: 广东省东莞市沙田镇齐沙村南围
- 专利权人: 富加宜连接器(东莞)有限公司
- 当前专利权人: 富加宜连接器(东莞)有限公司
- 当前专利权人地址: 广东省东莞市沙田镇齐沙村南围
- 代理机构: 东莞市永桥知识产权代理事务所
- 代理人: 何新华
- 主分类号: H01R13/504
- IPC分类号: H01R13/504 ; H01R13/02 ; H01R13/405
The invention provides a connector with an in-mold package and an injection molding package method thereof, comprising an upper shell and a lower shell, wherein an upper conductive terminal is arranged in the upper shell and a lower conductive terminal is arranged in the lower shell; An encapsulation molding cavity is formed between the upper housing and the lower housing, An upper injection mol positioning hole is arrange in that upper shell, A low injection molding position hole is arranged in that lower shell, An upper conductive terminal is connected to that top of the package molding cavity, The lower conductive terminal is connected with the bottom of the encapsulation molding cavity, and conductive resin is injected into the encapsulation molding cavity from the upper injection molding positioning hole or the lower injection molding positioning hole until the conductive resin fills the lower injection molding positioning hole, the encapsulation molding cavity and the upper injection molding positioning hole, and the conductive resin is cooled and solidified to form a conductive vibration absorber. The invention integrates the production and encapsulation actions of the special parts, has high production efficiency and eliminates the transportation and storage steps of the parts. The package formed by injection molding package can effectively improve the shielding and anti-vibration effect of the connector.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01R | 导电连接;一组相互绝缘的电连接元件的结构组合;连接装置;集电器 |
------H01R13/00 | H01R12/14或H01R24/00至H01R33/00组中所包含的各种连接装置的零部件 |
--------H01R13/02 | .接触部件 |
----------H01R13/502 | ..不同部件构成的 |
------------H01R13/504 | ...不同部件互相模压、胶合、焊接在一起,例如超声波焊接,或者被挤压在一起 |