A semiconductor device package structure and method are provided. The package structure includes: a first electrode sheet; A second electrode sheet disposed opposite to the first electrode sheet; A semiconductor device chip disposed between the first electrode sheet and the second electrode sheet; Supporting member, provided on the side of the semiconductor device chip, so as to form a cavity between the semiconductor device chip, the first electrode sheet and the support member and/or the semiconductor device chip, the second electrode sheet and the support member, and the support member hasa through hole penetrating through the support member and communicating with the cavity. When the semiconductor device is in use, a conductive fluid is injected into the cavity through a through holeon the supporting part, thereby effectively improving the reliability of the device package. The structure has good heat dissipation effect on semiconductor device chip. At the same time, the structurehas good self-protection function, once the liquid leaks, the upper electrode or the lower electrode will automatically open circuit with the chip.