基本信息:
- 专利标题： 一种超声场耦合共熔池双丝CMT电弧增材成型工艺方法
- 专利标题（英）：Ultrasonic field coupling common molten pool double-wire CMT electric arc additional material forming method
- 申请号：CN201810830871.4 申请日：2018-07-26
- 公开(公告)号：CN108856974A 公开(公告)日：2018-11-23
- 发明人： 尹立孟 , 王金钊 , 胡慧琴 , 王刚 , 张宇鹏
- 申请人： 重庆科技学院
- 申请人地址： 重庆市沙坪坝区大学城东路20号
- 专利权人： 重庆科技学院
- 当前专利权人： 重庆科技学院
- 当前专利权人地址： 重庆市沙坪坝区大学城东路20号
- 代理机构： 重庆蕴博君晟知识产权代理事务所
- 代理人： 郑勇
- 主分类号： B23K9/04
- IPC分类号： B23K9/04 ; B23K9/095 ; B23K9/10 ; B23K9/32 ; B23K9/12 ; B23K9/133
The invention discloses an ultrasonic field coupling common molten pool double-wire CMT electric arc additional material forming method. The method has the advantages of high forming efficiency, low thermal input, small deformation, high surface quality, controllable structure property, strong capability of surface modeling and no limitation of structural style and material. The method comprises the following steps that S1, a target structure is designed and optimized through CAD and/or CAE and/or CAM; S2, an additional material forming method is designed and optimized according to the interaction mechanism among material status, technological parameters, microscopic structure and toughness; S3, a finished product with the target structure is obtained by implementing the additional material forming method through an additional material robot according to technological parameters of the additional material forming method.
公开/授权文献:
- CN108856974B 一种超声场耦合共熔池双丝CMT电弧增材成型工艺方法 公开/授权日：2020-11-27
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K9/00 | 电弧焊接或电弧切割 |
| --------B23K9/04 | .用于非接合目的的焊接，如堆焊 |