基本信息:
- 专利标题： 真空吸附垫和基板保持装置
- 专利标题（英）：Vacuum suction pad and substrate holder
- 申请号：CN201810286499.5 申请日：2018-03-30
- 公开(公告)号：CN108705422A 公开(公告)日：2018-10-26
- 发明人： 山本晓 , 中西正行 , 小寺健治
- 申请人： 株式会社荏原制作所
- 申请人地址： 日本国东京都大田区羽田旭町11番1号
- 专利权人： 株式会社荏原制作所
- 当前专利权人： 株式会社荏原制作所
- 当前专利权人地址： 日本国东京都大田区羽田旭町11番1号
- 代理机构： 上海华诚知识产权代理有限公司
- 代理人： 张丽颖
- 优先权： 2017-070755 20170331 JP
- 主分类号： B24B21/00
- IPC分类号： B24B21/00 ; B24B41/06 ; B24B57/02 ; B24B53/10
A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substrate holder 2; and a plurality of circular arc-shaped substrate holding convexities 38, provided on a top surface of the pad main body 37, for holding a substrate Wattracted by vacuum suction to the top surface of the pad main body 37, wherein the substrate holding convexities 38 are arranged concentrically with the circular pad main body 37, and width W1 in aradial direction of the substrate holding convexity 38 located on a radially outer side among the plurality of substrate holding convexities 38 is narrower than width W2 in the radial direction of thesubstrate holding convexity 38 on a radially inner side.
公开/授权文献:
- CN108705422B 真空吸附垫和基板保持装置 公开/授权日：2022-02-25
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B21/00 | 使用磨削或抛光带的机床或装置；以及附件 |