
基本信息:
- 专利标题: 具有液气分离机制的导热结构
- 专利标题(英):Heat conduction structure with liquid and gas separation mechanism
- 申请号:CN201710234248.8 申请日:2017-04-11
- 公开(公告)号:CN108692599A 公开(公告)日:2018-10-23
- 发明人: 林俊宏
- 申请人: 迈萪科技股份有限公司
- 申请人地址: 中国台湾新北市中和区一路150号16楼之4
- 专利权人: 迈萪科技股份有限公司
- 当前专利权人: 迈萪科技股份有限公司
- 当前专利权人地址: 中国台湾新北市中和区一路150号16楼之4
- 代理机构: 广东世纪专利事务所有限公司
- 代理人: 刘润愚
- 主分类号: F28D15/04
- IPC分类号: F28D15/04 ; F28F9/22
The invention relates to a heat conduction structure with a liquid and gas separation mechanism. The structure comprises a temperature equilibrium plate, a heat pipe, a partition plate and work fluid;the temperature equilibrium plate comprises a shell and a containing cavity, the shell is provided with a bottom plate and a vertical plate, a first capillary structure is arranged on the inner surface of the bottom plate, a penetrating hole is formed in the vertical plate, the heat pipe comprises a pipe body and a second capillary structure, the pipe body is provided with the opening end, the opening end of the pipe body is in through-connection seal in a manner of corresponding to the penetrating hole, the partition board is laid on the opening end and covers the first capillary structure and the second capillary structure, a gas runner and a liquid runner are formed on the two sides of the partition board, and the containing cavity is filled with the work fluid. Backflow liquid-state work fluid cannot be affected by flowing of gas-state work fluid, and the backflow speed of the liquid-state work fluid is improved.
IPC结构图谱:
F | 机械工程;照明;加热;武器;爆破 |
--F28 | 一般热交换 |
----F28D | 不包含在其他小类中的热交换设备,其中热交换介质不直接接触的;一般贮热装置或设备 |
------F28D15/00 | 在通入或穿过通道壁的封闭管道里有中间传热介质的热交换设备 |
--------F28D15/02 | .其中介质凝结和蒸发,例如热管 |
----------F28D15/04 | ..带有毛细结构管束的 |