基本信息:
- 专利标题： 基板的研磨装置和基板的处理系统
- 专利标题（英）：POLISHING DEVICE OF SUBSTRATE AND PROCESSING SYSTEM OF SUBSTRATE
- 申请号：CN201810151773.8 申请日：2018-02-14
- 公开(公告)号：CN108453618A 公开(公告)日：2018-08-28
- 发明人： 安田穗积 , 小畠严贵 , 高桥信行 , 作川卓 , 高田畅行
- 申请人： 株式会社荏原制作所
- 申请人地址： 日本东京都大田区羽田旭町11番1号
- 专利权人： 株式会社荏原制作所
- 当前专利权人： 株式会社荏原制作所
- 当前专利权人地址： 日本东京都大田区羽田旭町11番1号
- 代理机构： 上海华诚知识产权代理有限公司
- 代理人： 张丽颖
- 优先权： 2017-031243 2017.02.22 JP
- 主分类号： B24B37/07
- IPC分类号： B24B37/07 ; B24B37/20 ; B24B37/005 ; B24B37/34
The invention provides a polishing device of a substrate and a processing system of a substrate, being able to reduce the deviation of unit of processing trace and shape relative to the specified shape. A polishing device for locally polishing a substrate is provided. The polishing device includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the first drive mechanism and the second drive mechanism so as to use the polishing member to locally polish the substrate.
IPC结构图谱:
| B | 作业；运输 |
| --B24 | 磨削；抛光 |
| ----B24B | 用于磨削或抛光的机床、装置或工艺；磨具磨损表面的修理或调节；磨削，抛光剂或研磨剂的进给 |
| ------B24B37/00 | 研磨机床或装置，即需要在相对软但仍为刚性的研具和被研磨表面之间加入粉末状磨料；及其附件 |
| --------B24B37/005 | .研磨机床或装置的控制装置 |
| ----------B24B37/07 | ..以工件或研具的运动为特征 |