![一种具有阶梯槽的PCB的制作方法及PCB](/CN/2018/1/21/images/201810107808.jpg)
基本信息:
- 专利标题: 一种具有阶梯槽的PCB的制作方法及PCB
- 专利标题(英):Manufacturing method of PCB (Printed Circuit Board) with stepped slot and PCB
- 申请号:CN201810107808.8 申请日:2018-02-02
- 公开(公告)号:CN108323040A 公开(公告)日:2018-07-24
- 发明人: 刘梦茹 , 焦其正 , 纪成光 , 金侠 , 巢中桂
- 申请人: 生益电子股份有限公司
- 申请人地址: 广东省东莞市东城区(同沙)科技工业园同振路33号
- 专利权人: 生益电子股份有限公司
- 当前专利权人: 生益电子股份有限公司
- 当前专利权人地址: 广东省东莞市东城区(同沙)科技工业园同振路33号
- 代理机构: 北京集佳知识产权代理有限公司
- 代理人: 张春水; 唐京桥
- 主分类号: H05K3/46
- IPC分类号: H05K3/46 ; H05K1/18
The invention relates to the technical field of PCBs (Printed Circuit Boards), and discloses a manufacturing method of a PCB with a stepped slot and a PCB. The manufacturing method comprises the stepsof laminating a plurality of core plates to form a PCB, manufacturing an initial stepped slot in a preset area of the PCB in a depth-controlled milling mode, wherein the depth of the initial steppedslot is less than predetermined stepped slot depth; removing a residual resin layer of a non-metallic circuit pattern area at the bottom of the initial stepped slot until a first part of bottom copperis exposed, and removing the first part of bottom copper; and removing the residual resin layer of the left area at the bottom of the initial stepped slot until a second part of bottom copper is exposed, and forming a preset metal circuit pattern. According to the embodiment of the invention, a stepped slot with the bottom being provided with the metal circuit pattern can be manufactured, accurate control can be performed on the depth of the stepped slot in the manufacturing process so as to enable the stepped slot to reach a specified layer, and no gasket is required to be used. Furthermore,the pattern at the bottom of the slot can be manufactured in an efficient and high-quality manner, the cost is low, and the process is simple, so that the manufacturing method is suitable for mass production.
公开/授权文献:
- CN108323040B 一种具有阶梯槽的PCB的制作方法及PCB 公开/授权日:2021-01-19
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/46 | .多层电路的制造 |