
基本信息:
- 专利标题: 温敏阻燃微胶囊及制备方法及包含该胶囊的硅胶泡沫材料
- 申请号:CN201711209028.6 申请日:2017-11-27
- 公开(公告)号:CN108250487B 公开(公告)日:2019-11-12
- 发明人: 邓军 , 康付如 , 焦冬生 , 王伟峰 , 易欣 , 张嬿妮 , 刘志超
- 申请人: 西安科技大学
- 申请人地址: 陕西省西安市碑林区雁塔中路58号
- 专利权人: 西安科技大学
- 当前专利权人: 陕西西科守安科技有限公司
- 当前专利权人地址: 710000 陕西省西安市西咸新区沣东新城王寺街道西部生命科学园4号楼401室
- 代理机构: 西安智邦专利商标代理有限公司
- 代理人: 杨引雪
- 主分类号: C08K9/10
- IPC分类号: C08K9/10 ; B01J13/02 ; C08G77/20 ; C08L83/04 ; C08J9/00
The invention more specifically relates to a temperature-sensitive flame-retardant microcapsule, a preparation method thereof, and a silica gel foamed material containing the temperature-sensitive flame-retardant microcapsule. The preparation method is mainly used for solving problems in the prior art that increasing of the flame resistance of silica gel foamed materials is limited by conventionalfire retardant adding method, and material mechanical properties and physical mechanical properties are influenced. The temperature-sensitive flame-retardant microcapsule comprises a capsule wall anda core layer; the core layer is coated by the capsule wall; the core layer is a fire retardant; the capsule wall is composed of ultraviolet light cured polysiloxane, a middle and high temperature foaming agent, a surfactant, a photoinitiator, and tetramethylol methane tetraacrylate. The compatibility of the temperature-sensitive flame-retardant microcapsule with silica gel is excellent; flame resistance is achieved through release of the fire retardant in the temperature-sensitive flame-retardant microcapsule; when indoor combustion is caused, expansion of the middle and high temperature foaming agent in the capsule wall is realized, the capsule wall is broken, the fire retardant in the core material is released, so that flame retardation is realized effectively.
公开/授权文献:
- CN108250487A 温敏阻燃微胶囊及制备方法及包含该胶囊的硅胶泡沫材料 公开/授权日:2018-07-06
IPC结构图谱:
C | 化学;冶金 |
--C08 | 有机高分子化合物;其制备或化学加工;以其为基料的组合物 |
----C08K | 使用无机物或非高分子有机物作为配料 |
------C08K9/00 | 使用预处理的配料 |
--------C08K9/10 | .包胶的配料 |