The invention relates to a stacked packaging structure with a pin side wall tin climbing function and a manufacturing technology thereof. The structure comprises a first base island and a first pin, wherein the first pin comprises a plane part and a side wall part, the side wall part comprises a plurality of side wall faces, and the plane part and the side wall part are in transition connection through an arc-shaped part; the front face of the first base island is provided with a first chip, the peripheral area of the first base island, the first pin and the first chip is packaged with a firstmolding compound, the surface of the first molding compound is provided with a second base island and a second pin, the front face of the second base island is provided with a second chip, and the peripheral area of the second base island, the second pin and the second chip is packaged with a second molding compound. During PCB welding, soldering tin can be climbed to a relatively high height along vertical side wall, so that the bonding area of soldering tin and pin is increased; and simultaneously, air at pin positions can be discharged out along the convex arc, so that the welding performance and reliability of the product are improved.