基本信息:
- 专利标题： MEMS组件及其制造方法
- 专利标题（英）：MEMS component and manufacturing method thereof
- 申请号：CN201711469518.X 申请日：2017-12-29
- 公开(公告)号：CN108117034A 公开(公告)日：2018-06-05
- 发明人： 闻永祥 , 刘琛 , 季锋 , 张小丽
- 申请人： 杭州士兰集成电路有限公司
- 申请人地址： 浙江省杭州市杭州经济技术开发区10号大街(东)308号
- 专利权人： 杭州士兰集成电路有限公司
- 当前专利权人： 杭州士兰集成电路有限公司,杭州士兰微电子股份有限公司
- 当前专利权人地址： 浙江省杭州市杭州经济技术开发区10号大街(东)308号
- 代理机构： 北京成创同维知识产权代理有限公司
- 代理人： 蔡纯; 张靖琳
- 主分类号： B81B1/00
- IPC分类号： B81B1/00 ; B81B7/02 ; B81C1/00
The invention discloses an MEMS component and a manufacturing method thereof. The method comprises the following steps: forming a groove on a sensor ship; forming a bonding pad on a device ship; bonding the sensor chip with the device ship to form a bonding component; executing first scribing on a first position of the sensor chip to penetrate through the sensor chip to arrive at the groove; and executing second scribing on a second position of the sensor chip to penetrate through the sensor chip and the device ship to separate the bonding component into single MEMS components, wherein the position of the groove corresponds to that of the bonding pad, and during the second scribing, an opening is formed in the sensor chip to expose the bonding pad. According to the method, twice scribing with different depths are executed to expose the bonding pad of the sensor chip and cut the MEMS component, thereby improving the yield and the reliability.
公开/授权文献:
- CN108117034B MEMS组件及其制造方法 公开/授权日：2023-12-26
IPC结构图谱:
| B | 作业；运输 |
| --B81 | 微观结构技术 |
| ----B81B | 微观结构的装置或系统，例如微观机械装置 |
| ------B81B1/00 | 不具有活动或柔性元件的装置，例如微毛细管装置 |