The invention discloses an aluminium nitride ceramic support. The aluminium nitride ceramic support includes a solid crystal groove, a silver layer, an accommodating space, a heat conduction chip anda refrigeration sheet. A body is fixedly provided with a boss on the internal side thereof, and a negative electrode welding plate is fixed on the top of the bevel of the boss. A positive electrode welding plate is fixedly on the bottom of the boss in an inclined direction, and the surface of the boss is provided with an accommodating space. A retaining wall structure is fixedly provided with thesolid crystal groove in the periphery thereof, and the retaining wall structure is provided with a positioning hole thereabove. Two sides of the boss are fixedly provided with a heat dissipation hole.The boss and the body are connected through a substrate. The silver layer is fixedly provided with a ceramic welding plate thereon. The refrigeration sheet is provided with the heat conduction chip thereabove, and the heat conduction chip is provided with the accommodating space thereabove. The aluminium nitride ceramic support effectively increases the heat dissipation effects of products by fixedly installing heat dissipation holes on two sides of the boss, and is conducive to the acceleration of heat conduction and the increase of heat dissipation effects by configuring the refrigeration sheet. The aluminium nitride ceramic support herein is advantaged by reasonable design and easy use.