基本信息:
- 专利标题： 采用传输装置制造集成电路器件的方法
- 专利标题（英）：METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT DEVICE BY MEANS OF TRANSFERRING APPARATUS
- 申请号：CN201711047437.0 申请日：2017-10-31
- 公开(公告)号：CN108010874A 公开(公告)日：2018-05-08
- 发明人： 张珉九 , 李晌熙
- 申请人： 三星电子株式会社 , 细美事有限公司
- 申请人地址： 韩国京畿道
- 专利权人： 三星电子株式会社,细美事有限公司
- 当前专利权人： 三星电子株式会社,细美事有限公司
- 当前专利权人地址： 韩国京畿道
- 代理机构： 北京市柳沈律师事务所
- 代理人： 王新华
- 优先权： 10-2016-0143076 2016.10.31 KR
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/027
The invention provides a method for manufacturing an integrated circuit device by means of a transferring apparatus. In one embodiment, the transferring apparatus comprises a rail connected to a frame, a travelling part including a wheel that travels along the rail and a loading part for loading an object, and a particle collection receptacle provided at a side of the rail and configured to collect particles generated due to friction between the wheel and the rail when the wheel travels along the rail. A method of manufacturing an integrated circuit device using the transferring apparatus includes moving the travelling part to the object, picking up the object with the loading part thereby loading the object on the loading part, using the travelling part to move the object to a chamber, and forming a semiconductor device using the object.
公开/授权文献:
- CN108010874B 采用传输装置制造集成电路器件的方法 公开/授权日：2021-12-14