The invention provides a quick-cooling IC carrying plate which comprises a ceramic substrate. A first IC substrate, second IC substrates and flexible circuit boards are arranged on the ceramic substrate, the first IC substrate is arranged in a central area of the ceramic substrate, the second IC substrates are symmetrically arranged on two sides of the first IC substrate, and the flexible circuitboards are symmetrically arranged at upper and lower ends of the second IC substrates. The second IC substrates are assisted through the flexible circuit boards, and implementation is conducted on thefirst IC substrate, so that overall performance of the quick-cooling IC carrying plate is remarkably improved; the problem that IC carrying plates are difficult in cooling is solved effectively by arranging a cooling structure; strong adhesion binding force exists between a protective coating and an insulating layer, the quick-cooling IC carrying plate has excellent flame-retardant performance and resistance to salt spray, and inside structure of the quick-cooling IC carrying plate can be protected effectively.