![用于电气电路的基底和用于制造这种基底的方法](/CN/2016/8/8/images/201680041496.jpg)
基本信息:
- 专利标题: 用于电气电路的基底和用于制造这种基底的方法
- 专利标题(英):Substrate for electrical circuits and method for producing such a substrate
- 申请号:CN201680041496.4 申请日:2016-07-18
- 公开(公告)号:CN107848245A 公开(公告)日:2018-03-27
- 发明人: 安德烈亚斯·迈尔 , 卡斯滕·施密特
- 申请人: 罗杰斯德国有限公司
- 申请人地址: 德国埃申巴赫
- 专利权人: 罗杰斯德国有限公司
- 当前专利权人: 罗杰斯德国有限公司
- 当前专利权人地址: 德国埃申巴赫
- 代理机构: 北京集佳知识产权代理有限公司
- 代理人: 丁永凡; 李建航
- 优先权: 102015111667.7 2015.07.17 DE
- 国际申请: PCT/EP2016/067074 2016.07.18
- 国际公布: WO2017/013075 DE 2017.01.26
- 进入国家日期: 2018-01-15
- 主分类号: B32B5/12
- IPC分类号: B32B5/12 ; B32B5/20 ; B32B7/12 ; B32B9/00 ; B32B9/04 ; B32B9/06 ; B32B29/08
The invention relates to a substrate (1, 10) for electrical circuits, comprising at least one metal layer (2, 3, 14) and a paper ceramic layer (11), which is joined face to face with the at least onemetal layer (2, 3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at leastone metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a', 6a'', 6b', 6b'') to the metal layer (2, 3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue(6a', 6a'', 6b', 6b'').
IPC结构图谱:
B | 作业;运输 |
--B32 | 层状产品 |
----B32B | 层状产品,即由扁平的或非扁平的薄层,例如泡沫状的、蜂窝状的薄层构成的产品 |
------B32B5/00 | 以非同质性或物理结构薄层为特征的层状产品 |
--------B32B5/02 | .以由纤维或细丝构成的薄层的结构特征为特征的 |
----------B32B5/12 | ..以相邻薄层的纤维或细丝的相对排列为特征的 |