基本信息:
- 专利标题： 一种解决连接器掉PAD的设计方法
- 专利标题（英）：Design method for solving problem of falling off PAD from connector
- 申请号：CN201710992348.7 申请日：2017-10-23
- 公开(公告)号：CN107820369A 公开(公告)日：2018-03-20
- 发明人： 张小行
- 申请人： 郑州云海信息技术有限公司
- 申请人地址： 河南省郑州市郑东新区心怡路278号16层1601室
- 专利权人： 郑州云海信息技术有限公司
- 当前专利权人： 郑州云海信息技术有限公司
- 当前专利权人地址： 河南省郑州市郑东新区心怡路278号16层1601室
- 代理机构： 济南信达专利事务所有限公司
- 代理人： 姜明
- 主分类号： H05K3/34
- IPC分类号： H05K3/34
The present invention discloses a design method for solving a problem of falling off a PAD from a connector, belonging to the field of PCBA board card technology. For a PCB Layout beside a connector,a design of increasing Pin copper foil area is employed to enhance stretching resistance of the PAD in a condition without changing a size of exposed PAD, wherein the width of the Pin copper foil is at least twice of the width of the PAD, and the length of the Pin copper foil is at least 1.2-1.5 times of the length of the PAD. The design method for solving a problem of falling off a PAD from a connector is suitable for all the board cards with the similar connectors, and therefore, the problem of falling off a PAD from a connector is effectively solved, and maintenance cost, board card scrap cost and human cost caused by the problems are reduced.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/32 | ..电元件或导线与印刷电路的电连接 |
| ------------H05K3/34 | ...通过焊接的 |