A bond head structure of a 180-degree die bonder comprises a driving device and a swing arm mechanism, wherein the driving device comprises a Z-axis motor and a rotating motor; the Z-axis motor is arranged on a Z-axis installing seat; a motor shaft of the Z-axis motor is connected with an eccentric shaft through a bearing; the eccentric shaft is connected with a connecting rod; the connecting rodis connected with a Z-axis connecting block; a motor shaft of the rotating motor is connected with a rotating shaft; the rotating shaft is provided with a swing arm guide rail; the swing arm guide rail is provided with a swing arm connecting block in a clamping way; the swing arm connecting block is rotationally connected with the Z-axis connecting block through a fixed shaft and is locked througha nut; the swing arm mechanism is fixedly connected with the swing arm connecting block; the rotating motor drives the swing arm mechanism to swing within a 180-degree range. According to the bond head structure disclosed by the invention, a flexible swing arm structure is adopted, the stress of a swing arm can be regulated, and the flexibility of the swing arm can be increased; due to the designof the bond head structure of the 180-degree die bond, the die bonding speed can be increased while the layout of effectively reducing the volume of a bond head zone and optimizing all components iscarried out.