
基本信息:
- 专利标题: 一种功率模块陶瓷衬板
- 申请号:CN201710827140.X 申请日:2017-09-14
- 公开(公告)号:CN107768340B 公开(公告)日:2019-12-06
- 发明人: 常桂钦 , 窦泽春 , 方杰 , 彭勇殿 , 童颜 , 李继鲁 , 肖红秀 , 徐凝华 , 曾雄 , 万超群
- 申请人: 株洲中车时代电气股份有限公司
- 申请人地址: 湖南省株洲市石峰区时代路169号
- 专利权人: 株洲中车时代电气股份有限公司
- 当前专利权人: 株洲中车时代半导体有限公司
- 当前专利权人地址: 湖南省株洲市石峰区时代路169号
- 代理机构: 湖南兆弘专利事务所
- 代理人: 陈晖
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L25/18
The invention discloses a ceramic lining plate of a power module. The ceramic lining plate comprises a first metal layer, a second metal layer and a third metal layer which are sequentially arranged from top to bottom, wherein a first ceramic layer is arranged between the first metal layer and the second metal layer, a second ceramic layer is arranged between the second metal layer and the third metal layer, the first metal layer is configured to be an emitter region and a control signal terminal region which are isolated with each other, the second metal layer is configured to be a collectorregion, the second metal layer also can further extend to an upper surface of the first ceramic layer via a through hole, grooves are formed in an upper surface of the lining plate along a thickness direction and are respectively used for installing a first power chip and a second power chip, and the grooves extend to the first metal layer from the first metal layer. By the ceramic lining plate, the technical problems that a circuit interconnection structure of the ceramic lining plate of an existing power module is large in stray inductance, a welding tool is needed to be used during chip welding, a metal liner on a front surface of the lining plate is a combination layer of strong electricity and weak electricity and interconnection between the lining plates is relatively complicated canbe solved.
公开/授权文献:
- CN107768340A 一种功率模块陶瓷衬板 公开/授权日:2018-03-06
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
------------H01L23/495 | ...引线框架的 |